Our experts in this field
Within the Demmel Group we have dedicated specialists for this product category. For more information, please visit the websites of the individual companies:
Before shipping components, we test every circuit board, prototype and series using automatic optical inspection (AOI) and random radiographic testing (X-ray). Thanks to our in-house analytics capabilities, we provide further testing options as well.
Microsection analysis of ball grid array (BGA) components with PCB connection.
Analytical investigation of a capacitor with a closed connection to PCB.
Within the Demmel Group we have dedicated specialists for this product category. For more information, please visit the websites of the individual companies:
