Analytics & X-ray testing

Before shipping components, we test every circuit board, prototype and series using automatic optical inspection (AOI) and random radiographic testing (X-ray). Thanks to our in-house analytics capabilities, we provide further testing options as well.

Our service

Microsection analysis of ball grid array (BGA) components with PCB connection.

Analytical investigation of a capacitor with a closed connection to PCB.

Our experts in this field

Within the Demmel Group we have dedicated specialists for this product category. For more information, please visit the websites of the individual companies: